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Save the Date for the 31^ST Materials for Advanced Metallization 2024

MAM 2024 will be the 31^ST in a series of conferences devoted to research on materials and processes for the back and front end of the line, including interconnect and silicide materials. Starting as a workshop on refractory metals and silicides in the 1980s and moving towards materials for advanced metallization in 1995.  The objective of the conference is to provide a forum for open discussions across fundamental and applied sciences and industrial applications. It is dedicated to international material scientists, process and integration engineers, and students.  Keynote presentations and invited talks will be given by scientific and technical leaders in each of the key areas to present the current state-of-the-art and to stimulate technical discussions.
MAM2024

During MAM 2024, a workshop will spotlight Wide Band Gap Materials and Devices, which are revolutionizing industries such as power electronics, renewable energy and electric vehicles. The workshop will present the current state-of-the-art of the technology development and the latest trends in the industry for these applications.

Location

This year’s conference will be held in the dynamic and historic city of Milan, Italy – More info

Key dates

​Abstracts due: December 06, 2023 / Abstract Submission

Paper Notification: January 12, 2024

Early Registration: February 06, 2024 / Register

Workshop Wide Band Gap Materials and Devices: 18 March 2024

MAM Conference: 19-21 March 2024

Call for Papers

Abstract Submission

2-page abstracts (including figures) are solicited in the following areas:

Materials, Processes & Integration 

1. Metallization for advanced interconnects: local interconnects, contacts, metal gates, through silicon vias, power semiconductors 
2. Dielectrics: porous ULK, hybrid materials, pore sealing & stuffing, MOF, patterning, cleaning, restoration, surface functionalization 
3. Metal or dielectric liners and diffusion barriers: etch-stop, capping 
4. Deposition: PVD, CVD, ALD, ELD, ECD, SAMs, reflow, e-beam 
5. Patterning processes and integration: double & triple patterning, advanced etching techniques, Atomic Layer Etching (ALE) 
6. Planarization: CMP, slurry, pad, anti-corrosion methods 
7. Device integration and novel architectures: local interconnects 
8. Silicides and germanides 
9. Contacts to III-V materials: CMOS, power, LED, Laser, photonics applications 
10. Materials for memories and memristive devices 
11. 1D and 2D Nanomaterials: graphene, carbon nanotubes, nanowires, nanodots 
12. 2D & 3D Packaging materials and technologies 

Advanced Characterization and Modeling techniques 

1. Analytical techniques: defect inspection, X-ray/electron tomography, spectroscopy, microscopy, scanning probe methods, atom probe tomography, correlative methods, metrology 
2. Reliability and failure analysis: lifetime extrapolation methodologies, chip-package interaction (CPI) 
3. Modeling and simulation of process steps: equipment, interconnect systems, materials properties, nanoscale devices, reliability, all with experimental validations 

Applications including nanoscale 

1. 3D integration: COW, WOW, thinning, bonding, TSV, micro-bumps 
2. System-on-chip and system-in-package 
3. Power Electronics / IGBTs and materials / interconnects for GaN & SiC (devices and interconnects)
4. MEMS/NEMS: sensors and actuators 
5. Memories devices: MRAM, FeRAM, CBRAM, PCRAM, ReRAM 
6. Quantum Devices 
7. Biochips: electrodes, microfluidics control, heterogeneous integration

 On behalf of the MAM2024 committees

www.mam2024.org

CONTACT

info@mam2024.org

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